Nordson ASYMTEK’s advanced multiple camera imaging technology offers high-speed inspection with exceptional defect coverage. With dual sided viewing (top-down and bottom up) cameras and UV lighting the FX-942 ACI inspects conformal coating coverage a
Test Coach has been delivering the highest quality in-circuit test programs since 1998. Our engineers have the education, experience and expertise needed to solve your most challenging test requirements. We partner with our customers to provide CUSTO
Electronics Forum | Mon Apr 02 09:57:18 EDT 2012 | vparis
Our company is having issues with our YesTech F1 AOI machine the programs are currently not utilizing this machine correctly. we are have a false call rates of about 5% to as high as 12% of the total number of inspection points. I have started to rep
Electronics Forum | Wed Apr 04 13:33:12 EDT 2012 | rway
We currently have 2 M1 systems. Our false call rate has never been has high as you suggest. There is something wrong with your program and/or inspection algorithms, as you probably already know. You should be somewhere between 1000-1500 vcpmo (fal
Used SMT Equipment | AOI / Automated Optical Inspection
BF-Frontier is used in the inspection of large-size printed circuit boards. In this device, the unique control sequence of software and hardware, accelerated scanning mode and stable optical illumination system can allow BF-Frontier to easily complet
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Industry News | 2014-04-22 14:31:18.0
MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Technical Library | 2012-12-14 14:25:37.0
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test.
Overview of Machine Vision Product's Supra E, Ultra IV and Spectra Automated Optical Inspection Systems.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.